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| About site: http://www.solid-state-technology.com |
Title: Electronics and Electrical/Directories - Semiconductor Resource Guide Online source for semiconductor research, buying guide, calendar of events, and editorial archives. |
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Semiconductor_Links Semiconductor related resources for the semiconductor industry. [more]
| Semi-Conductor_nl Directory of semiconductor, IC, and printed circuit board manufacturer web sites, grouped by category and sorted alphabetically, with one-line descriptions. [more]
| Silicon_Korea_Map Company directory for semiconductor resources. [more]
| SupplyView__com Online searchable database of electronic components for oem's, cem's, franchise distributors and brokers. [more]
| Mainland_Public_Relations A financial PR company, specializes in personal finance, institutional fund management and business-to-business financial services. [more]
| Market_Pulse Promotes emerging growth companies. [more]
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Solid State Technology Magazine- Semiconductor industry news covering semiconductor manufacturing, mems manufacturing, wafer news, itrs, microlithography and more
Solid State Technology Magazine- Semiconductor industry news covering semiconductor manufacturing, mems manufacturing, wafer news, itrs, microlithography and more Subscribe! eNewsletter Magazines About Us | Advertise | Contact Us | Site Map Search: Advanced Search Home Technology Applications Multimedia Resources Resource Guide Blogs Events #currentIssueImageWrapper { width: 100%;text-align: center; } Current Publications Solid State Technology Microlithography World WaferNews PV Times SST Review Resource Guide View Archives var imageManager = { clearImages:function( ) { var images = $$('#currentIssueImageWrapper .current-issue-image'); images.each( function( image ) { image.hide(); }); }, reset:function() { this.clearImages(); this.changeImage( 'DEFAULTCurrentIssue' ); }, changeImage:function( imgId ) { this.clearImages(); if( $( imgId ).src == '' || $( imgId ).src == 'http://images.pennnet.com/' ) { this.reset(); } else { $( imgId ).show(); } } } Event.observe( window, "load", new function() { imageManager.reset(); }); Global Publications SST China SST Taiwan Semi-FPD Monthly Korea Nikkei Microdevices
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Solid State Technology - semiconductors, chips, integrated circuits Latest News Technology Features Web Features Products Haze and sun for mask symposium Oct 13 - Highlights from last week's SPIE/BACUS Symposium on Photomask Technology in Monterey CA, include discussion of damage to pellicles caused by aggressive 193nm radiation, what's behind a new "sun effect" linked to clearing off reticle haze, more calls to replace chrome with opaque MoSi, why mask industry sales are improperly skewed, and the difficulty of migrating to smaller dimensions. Handicapping the Micron-Qimonda-Nanya shuffle Oct 13 - Qimonda's selling its stake in its memory JV with Nanya to Micron, who are already in their own JV (for now) using a different DRAM technology. It's a shakeout for all three parties, in aspect of finance, manufacturing, technology, and strategy. Here's a quick rundown of who gains what. iSuppli issues chip forecast downgrade, warning Oct 10 - The ugly economic condition still unfolding daily and globally is behind yet another chip industry downgrade, this time by iSuppli Corp. The firm now sees a 3.5% increase in chip sales this year to $280.1B, slightly below the 4% growth it predicted just two months ago. AMD redux: Analysts question foundry plan's future Oct 09 - There appear to be two camps of perspective regarding AMD's spinoff off its manufacturing operations into a "Foundry Company" with help from Abu Dhabi investors. From a financial POV it's good to clean up AMD's books -- but strategically it's still unclear how the move will succeed in the foundry sector. More News From the Wires ISMI Symposium to feature "State of Semiconductor Manufacturing" panel Business Wire (October 14, 2008) LDK Solar: On track for 5-7k MT polySi plant output in '09 PR Newswire (October 14, 2008) SemiLEDs orders multiple Ultratech litho tools PR Newswire (October 14, 2008) Aviza ships PVD systems to a GaAs devicemaker Business Wire (October 14, 2008) Ascent Solar updates manufacturing progress, expansion plans Business Wire (October 14, 2008) Ex-Samsung exec Oh joins Denali PR Newswire (October 14, 2008) HDIC, SMIC tout "successful" high-def TV chip debut during Beijing Olympic Games PR Newswire (October 14, 2008) Japan to review tariffs on Korea's Hynix AFX News Limited (October 14, 2008)  More Wire News Realizing the 450mm transition - The International SEMATECH Manufacturing Initiative (ISMI) is actively involved in building the foundational infrastructure and coordination of activities to enable a 2012 pilot line target date at the direction of its members. Innovative refractive optics for exposure tool illumination - Arrays of refractive micro-optics are ideal homogenizing elements in illumination systems for exposure and metrology tools. Accelerating productivity: key to industry prosperity - ISMI â?? it’s all about productivity: increasing output and decreasing costs. Strategies for energy reduction in semiconductor manufacturing - ISMI’s Environment Safety Health (ESH) Program has undertaken specific projects to demonstrate efficiency and conserve energy in semiconductor manufacturing operations. A vision for a next-generation 300mm factory - To help meet next-generation factory (NGF) challenges, ISMI has been tasked by its member companies to explore ways in which improvement in cycle time and cost reductions can achieve targets of 50% and 30%, respectively, by 2012. Product News - These two tools for wafer edge (E30) and backside inspection (B30) provide improved sensitivity and high throughput for inspection and in-line monitoring of 32nm FEOL and BEOL manufacturing processes.  More Technology Features Pinpointing the industry's disconnect between capex and utilization Jul 29 - by Pete Singer, editor-in-chief, Solid State Technology
George Scalise, president of SIA, talks with SST's Pete Singer about the semiconductor industry's disconnect between sluggish equipment demand and high capacity utilization, and offers possible answers to the conundrum. WCJTG speakers summarize 32nm USJ progress Jul 22 - John O. Borland, organizer of the West Coast Junction Technology Group Meeting (WCJTG) held the final morning of SEMICON West, talks on camera to discuss the group's latest research, and other presenters provide summaries of their talks. SEMI's policy wish-list for US prez candidates Jul 18 - Vicki Hadfield, president of SEMI North America, outlines SEMI's stance on the four "Ts" of US government policy key to its members (tax, trade, technology, and talent), with key elements including prioritization of alternative energy investments (notably tax credits for solar energy), a one-year depreciation for equipment, and an increase in the H1-B visa quota. Extending/complementing optical litho using S-FIL for memory applications Jul 04 - New technologies are needed to keep the semiconductor industry on track with Moore's Law. Step and Flash Imprint Lithography (S-FIL) has gained traction in recent years among several leading memory manufacturers.  Nothing to display.  More Products Event.observe( window, "load", function(e) { switchTab('topicCenterBox',0); }); Chip Forensics HP optimizes low-cost processing for inkjet printheads Aug 22 - One of the most common and most ignored types of chips is on almost every desk in this electronic world of ours -- the inkjet printhead. This edition of Chip Forensics examines a three-color printhead device out of Hewlett Packard's low-cost HP 60 Tricolor ink cartridge launched earlier this year. Two different approaches to integrated MEMS May 07 - by Dick James, Senior Technology Advisor, Chipworks
May 12, 2008 - After the 45nm hype of the last few months, let's go to the other end of the CMOS scale and examine some interesting MEMS devices that are leading the penetration into new markets like consumer electronics -- and would not have been manufacturable without the deep etching processes that have evolved over the last few years. SST November 2007: Intel's evolution: Strained silicon to high-k and metal gate Oct 26 - EXECUTIVE OVERVIEW As we head toward Intel's announced 45nm launch this month, Dick James looks at the changes from the company's 90nm node transistor, through the 65nm node, and take a few guesses about what we might see in the upcoming 45nm part. SST September 2007: Looking inside Apple's iPhone: Rad-hard technology? Sep 04 - EXECUTIVE OVERVIEW In this edition of Chip Forensics, Dick James tears down Apple's 8GB iPhone, and the reverse engineering of a Peregrine RF switch similar to the one used by Apple within it, to look at the unusual silicon-on-sapphire (SoS) process used for its manufacture.  More Chip Forensics Event.observe( window, "load", function(e) { switchTab('blogBox',0); }); Wafer news Financials
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Chipmakers NSDQ Wafernews Equipment/Materials 162.45 -15.89 (-8.91%) Wafernews Chipmakers 85.45 -5.60 (-6.15%) Nasdaq Composite 1628.33 -150.68 (-8.47%) Index Price Change (%) Equip. / Mat. 162.45 -15.89 (-8.91%) Chipmakers 85.45 -5.60 (-6.15%) NSDQ 1628.33 -150.68 (-8.47%) NYSE 5759.96 -620.57 (-9.73%) S&P 500 907.84 -90.17 (-9.03%) Quotes delayed at least 20 mins. var me1 = document.module12992870 = new Object(); me1.init = function () { var me = document.module12992870; me.tickers = new Array(); me.tickers[0] = '$WNMEQ'; me.tickers[1] = '$WNCMK'; me.tickers[2] = '$COMP'; me.intervals = new Array(); me.intervals[0] = '1'; me.intervals[1] = '92'; me.intervals[2] = '183'; me.intervals[3] = '366'; me.curTicker = 0; me.curInterval = 1; me.tabs = new Array(); var nodes = document.getElementsByTagName('td'); for (var i = 0; i < nodes.length; i++) { if (nodes[i].getAttribute('name') == 'fctab12992870') { me.tabs.push(nodes[i]); } } me.content = new Array(); var nodes = document.getElementsByTagName('div'); for (var i = 0; i < nodes.length; i++) { if (nodes[i].getAttribute('name') == 'fccontent12992870') { me.content.push(nodes[i]); } } me.intervalEl = new Array(); var nodes = document.getElementsByTagName('a'); for (var i = 0; i < nodes.length; i++) { if (nodes[i].getAttribute('name') == 'fcinterval12992870') { me.intervalEl.push(nodes[i]); } } me.chartimg = document.getElementById('fcchartimg12992870'); me.chartlink = document.getElementById('fcchartlink12992870'); } setTimeout("document.module12992870.init()",1); me1.switchContent = function (pos) { var me = document.module12992870; me.curTicker = pos; for (var i = 0; i < me.tickers.length; i++) { if (me.tabs.length > i) { me.tabs[i].className = (i == pos) ? 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Upcoming Events International Wafer-Level Packaging Conference & Tabletop Exhibition October 13-16 2008 San Jose, CA The annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages. www.iwlpc.com International Wafer-Level Packaging Conference & Tabletop Exhibition October 13-16 2008 San Jose, CA The annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages. www.iwlpc.com 5th ISMI Symposium on Manufacturing Effectiveness October 22-23 2008 Austin, TX Web site Design and Test Challenges for 3D ICs November 3 2008 San Jose, CA The objectives of this workshop are to clarify the nature of the design and test challenges for 3D ICs, both near- and long-term, and to assess the state of the industry to support 3D IC design and test. Web site More Events Video Webcasts
Debra Vogler of Solid State Technology interviews Lars Liebmann, Distinguished Engineer, Design for Manufacturability at IBM, at the 2008 SPIE Advanced Lithography Conference.; 193nm lithography; 22nm; CMOS manufacturing; Extreme Ultraviolet (EUV); Lithography; SST on the Scene at SPIE; double patterning; high-index immersion lithography; meeting overlay tolerances; nanoimprint lithography (NIL); solid state technology; Debra Vogler of Solid State Technology interviews Benjamin Eynon, Associate Director of Lithography, and Samsung assignee to SEMATECH, at the 2008 SPIE Advanced Lithography Conference. ; 193nm lithography; 22nm; CMOS manufacturing; Extreme Ultraviolet (EUV); Lithography; SST on the Scene at SPIE; double patterning; high-index immersion lithography; meeting overlay tolerances; nanoimprint lithography (NIL); solid state technology; Debra Vogler of Solid State Technology interviews Mireille Maenhoudt, Litho Process Development Group Manager at IMEC, at the 2008 SPIE Advanced Lithography Conference.; 193nm lithography; 22nm; CMOS manufacturing; Extreme Ultraviolet (EUV); Lithography; SST on the Scene at SPIE; double patterning; high-index immersion lithography; meeting overlay tolerances; nanoimprint lithography (NIL); solid state technology; Debra Vogler of Solid State Technology interviews Franklin Kalk, CTO at Toppan Photomasks, at the 2008 SPIE Advanced Lithography Conference.; 193nm lithography; 22nm; CMOS manufacturing; Extreme Ultraviolet (EUV); Lithography; SST on the Scene at SPIE; double patterning; high-index immersion lithography; meeting overlay tolerances; nanoimprint lithography (NIL); solid state technology; Debra Vogler of Solid State Technology interviews John Sturtevant, RET Technology Support Manager at Mentor Graphics, at the 2008 SPIE Advanced Lithography Conference.; 193nm lithography; 22nm; CMOS manufacturing; Extreme Ultraviolet (EUV); Lithography; SST on the Scene at SPIE; double patterning; high-index immersion lithography; meeting overlay tolerances; nanoimprint lithography (NIL); solid state technology; Debra Vogler of Solid State Technology interviews Christopher Sparkes, Sr. Director of Technology at Nikon Precision, at the 2008 SPIE Advanced Lithography Conference.; 193nm lithography; 22nm; CMOS manufacturing; Extreme Ultraviolet (EUV); Lithography; SST on the Scene at SPIE; double patterning; high-index immersion lithography; meeting overlay tolerances; nanoimprint lithography (NIL); solid state technology;
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